In the intricate world of Printed Circuit Board (PCB) manufacturing, laser cutting technology is becoming increasingly vital. With the demand for smaller and more precise apertures, the use of ultraviolet nanosecond pulse lasers has surged. The production of PCBs, especially System-in-Package (SiP) materials, has benefitted immensely from advanced laser cutting techniques that promise high-speed, quality, and cost-effective solutions.
The Selection of the Ideal Laser for SiP Separation
Choosing the right laser for SiP separation involves a delicate balance between productivity, quality, and cost. For sensitive components, ultrashort pulse (USP) lasers with low thermal effects due to their ultraviolet wavelengths may be necessary. In other instances, nanosecond pulse and longer wavelength lasers offer a more cost-effective yet high-yield alternative. To demonstrate the high processing speeds achievable in SiP PCB substrate cutting, LASERCHINA engineers have tested a green light high-power nanosecond pulse laser. This laser cutting machine utilizes a dual-axis scanning galvanometer to achieve precise cuts in SiP materials, which consist of thin FR4 with embedded copper lines and a dual-sided solder mask, without significant thermal damage.
Clean Cuts Without Thermal Degradation
The high-speed multiple-pass scanning technique used by LASERCHINA’s laser cutting machine results in a net cutting speed of 200 mm/s, producing clean cuts on both the entrance and exit sides of the SiP substrate. The presence of copper lines does not adversely affect the cutting process, as evidenced by the minimal Heat Affected Zone (HAZ) and excellent edge quality of the copper cuts. Cross-sections of the cut walls reveal exceptional quality, minimal HAZ, and insignificant carbonization or debris, highlighting the precision of laser cutting in maintaining the integrity of both the copper lines and the surrounding FR4 material.
Laser Cutting for Thicker FR4 Boards
When it comes to thicker FR4 boards, nanosecond pulse lasers are a well-established application in PCB processing, separating devices by cutting small disconnection points within a panel. Using the LASERCHINA laser cutting machine, engineers have developed a novel disconnection point cutting process for device panels composed of approximately 900 µm thick FR4 boards. The key to achieving ideal throughput lies in using the largest possible spot diameter while maintaining sufficient energy density. The resulting cuts feature uniform spot size across the material thickness, facilitating efficient cutting and debris expulsion.
Laser cutting is revolutionizing the way PCBs are manufactured, offering unparalleled precision and speed in the production process. With the advancements demonstrated by LASERCHINA engineers, the industry can expect high-quality, high-speed, and cost-efficient solutions for both fine SiP materials and thicker FR4 boards. The meticulous balance of laser parameters ensures that even the most sensitive components are cut with minimal thermal impact, preserving the quality and functionality of the PCBs. As we continue to push the boundaries of laser cutting technology, we can anticipate even more innovative applications in the realm of electronics manufacturing.
CONTACT FOR LASER SOLUTIONS
With over two decades of laser expertise and a comprehensive product range encompassing individual components to complete machines, LASERCHINA is your ultimate partner for addressing all your laser-related requirements.